Molex® Wire-to-Board & Wire-to-Wire Connector Ranges

Since the company's formation in 1995 Connect-2 Technology has produced hundreds of thousands of wiring assemblies utilising a broad-range of Molex® wire-to-board and wire-to-wire connectors. The Molex crimp terminal ranges we support in the wire-to-board and wire-to-wire ranges have gradually increased, so that we now have auto and semi-automatic tooling to cover a large number of product families as follows: -

Molex PicoBlade (Pitch: 1.25mm [0.049"])

• Circuits: 2 to 15
• Current: 1A (26, 28, 30AWG)
• Mated Height: 3.40mm [0.138")

Designed for high-density harness applications, PicoBlade provides the same 1.0 amperes of current as similar 2.00mm (.079") pitch systems, but in a more compact space-saving design. The PicoBlade range is offered in wire-to-board and wire-to-wire options. The system saves about 45% of PCB space compared to typical 2.00mm wire-to-board systems. It is a single row system, available in 2 to 15 circuits, with both surface mount and through-hole headers.

Molex Mini-Fit Sr (Pitch: 10mm [0.394"])

• Circuits: 2 to 14
• Current: 50A
• Pitch: 10.00mm (.394")
• Wire AWG: 8 - 16

This is a compact 10.00mm (.394") high power connector system, capable of handling up to 50 amperes on a 2-circuit housing with an 8AWG wire. For use in wire-to-wire and wire-to-board applications, this high current system is finding use in applications ranging from computer work stations to power supplies to industrial equipment.

Standard 0.093" (Pitch: 5.03mm [0.198"])

• Circuits: 1 to 15
• Current: 14A
• Pitch: 5.03mm (.198")
• Wire AWG: 14 - 30

The Molex Standard .093" product line is an industry standard connector system based on 0.093" (2.36mm) pin diameter. The terminals are used in the 5.03mm (.198") pitch and the 6.71mm (.264") pitch 3191 series products.
The terminals are capable of carrying up to 14 (9A with the largest circuit size, but if the optional high-current/low-force terminal is used, the terminal is capable of 17A). The system is available in wire-to-wire and wire-to-board configurations and circuit sizes of 1 - 15. It is also worth noting that the terminals can be used in either the crimp housing or the crimp receptacle.
Standard .093" pin and socket power connectors are a flexible choice, for a wide variety of applications that have a need for medium power connectors.
Molex Mini-Fit Jr® (Pitch: 4.20mm [0.165"])

• Circuits: 2 to 24
• Current: 9A (lowest circuit size) 6A (highest)
• Wire AWG: 16 - 28
• UL, CSA & TUV approvals

The Mini-Fit Jr.® is ideal for higher-current / higher-density applications which require design flexibility for wire- to-wire and wire-to-board configurations. Mini-Fit connectors are ideal for power applications up to 9A per circuit.
The core attributes of Mini-Fit Jr. include: fully isolated terminals, positive housing locks, low-engagement forces and polarized housings. Mini-Fit Jr. products are UL recognized, CSA approved and TUV licensed. All components are lead-free and RoHS compliant.
Mini-Fit Jr. connectors are available in single row or dual row 2- to 24-circuit options, and features multiple plating and material selections, for most applications.

Disk Drive Power Connector (Pitch: 5.08mm [0.200"])

• Circuits: 4
• Current: 10A
• Wire AWG: 14 - 22
• UL, CSA & TUV approvals

Used to carry voltages from the power supply unit to the disk drive board.
Molex Micro-Fit 3.0 (Pitch: 3.00mm [0.118"])

• Circuits: 2 to 24
• Current: Up to 5A
• UL, CSA & TUV approvals

The Micro-Fit 3.0 connector is a unique inter-connect system designed to meet the need for a high contact density signal or power connector and incorporates many of the features previously found on larger power connectors. These 3.00mm (.118") pitch connectors are the perfect choice when you need compact connectors that carry up to 5 amperes of current. Micro-Fit products are available in circuit sizes 2 to 24 for single and dual row, wire-to-board and wire-to-wire applications.
The Micro-Fit 3.0 CPI® and Micro-Fit 3.0 BMI® CPI (blind mate interface) are compliant pin interface vertical header product extensions to this well known Micro-Fit family. These products are designed for high-density applications which require press-fit headers. The CPI products are appropriate for both power and signal uses as they can carry up to 5 amperes per circuit.
Standard 1.57mm 0.062" (Pin Diameter)

• Circuits: 1 to 36
• Current: Up to 5A
• Pitch: 3.68, 3.96 & 4.19
• Wire AWG: 18 to 30

A power or signal inter-connects system rated up to 5 amperes per circuit with standard brass terminals. Tough Nylon housings and robust terminal design create a durable, long lasting product. The Standard .062" products are reliable, economical and offer high value in features and price. These products provide an excellent choice for power or signal inter-connect applications.
Fast assembly reduces your applied costs. Round terminals may be oriented in any direction for fast assembly. Circuit identifiers and polarized housing design ensure accurate assembly. Dual terminal lock lances provide optimum contact stability. A wide range of crimp tooling to support any manufacturing need. With a variety of housing circuit sizes ranging from single circuit to 36 circuits, allowing you to select the product size that best fits your application.
Standard .062" products have a wide range of product options including free hanging or panel mount housings and 18-30 AWG terminals in brass and phosphor bronze base materials and tin or gold plating offer flexibility in design.
Molex SPOXTM (Pitch: 2.50 to 5.08mm [0.098" to 0.200"])

• Circuits: 2 to 16
• Current: 3A
• Pitch: 1.50, 2.50, 3.96 & 5.08
• Wire AWG: 18 - 30

The name 'Spox' comes from the shape of the terminal, which is like a "spring box". This design style provides multiple points of contact, protects the mating interface area and prevents fish-hooking from wires during handling.
The 2.50mm Mini-Spox family includes both crimp and IDT housings as well as both wire-to-board and wire-to-wire configurations. The 3.96mm Spox and 5.00/5.08mm Macro-Spox families include un-shrouded and partially shrouded headers, along with board-to-board options.
Molex KKTM (Pitch: 2.50 to 5.08mm [0.098" to 0.200"])

• Circuits: 2 to 28
• Current: 2.5 to 7A
• Pitch: 2.50, 2.54, 3.96 & 5.08
• Wire AWG: 18 - 30

The system offers interconnection in a number of modes; wire-to-board, board-to-board, both vertical and right angle, and board- or cable- to chassis. Features include a friction lock to secure connectors to wafer, polarizing wall or location pegs to assure correct assembly. Various methods of securely holding the connectors to a PC board are available. Headers are available in solid or breakaway, and housing termination can be crimp or IDT.
The Molex KK interconnection system can provide all the options necessary to complement PC board interconnection design requirements. For this reason, KK has become known as a versatile interconnecting system developed to meet the challenge of modularization.
Molex C-Grid® / SLTM (Pitch: 2.54mm [0.100"])

• Circuits: 1 to 100
• Current: 3A
• Pitch: 2.54mm
• Wire AWG: 22 to 36

C-Grid® is a dual row, board-to-board system. The system includes: vertical and right angle headers in breakaway, shrouded and dual-body styles; vertical and right angle receptacles; headers and receptacles for SMT applications; press-fit headers and a 2-circuit shunt completes the C-Grid product line. C-Grid has the ability to mate with SL and KK® products.
SLTM (Stackable Linear) is a modular, single row, wire-to-wire and wire-to-board system. The system includes: press-fit compliant-pin, low-profile, latching vertical- and right-angle headers; five stackable, low profile housing for male or female crimp terminals; pre-assembled, single piece pin and receptacle connector assemblies for IDT termination of discrete wire or ribbon cable and piercing crimp termination of FFC/FPC; single and dual row latching interim clips for stacking of subassemblies to form larger connectors; and panel mounts for modular wire-to-wire remote interconnections. These product families are suitable for low power signal applications such as computers, medical instruments, and automotive controls.
Molex C-Grid IIITM (Pitch: 2.54mm [0.100"])

• Circuits: 1 to 60
• Current: 3A
• Pitch: 2.54mm
• Compatible with DIN4165
• Wire AWG: 22 to 28

The 3rd generation C-Grid III 2.54mm (.100") pitch post and receptacle interconnection system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. C-Grid III is a highly-versatile 2.54mm interconnection system offering unique design features.

? Why not ask us to provide you with an example quote, just send your drawings/specifications via the details here or Telephone 01642 492220.